Kingston Technology KSM32ED8/16HE memory module 16 GB 2 x 8 GB DDR4 3200 MT/s ECC
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Power Supply: VDD = 1.2V Typical. VDDQ = 1.2V Typical. VPP = 2.5V Typical. VDDSPD = 2.2V to 3.6V. Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals. Low-power auto self refresh (LPASR). Data bus inversion (DBI) for data bus. On-die VREFDQ generation and calibration. Dual-rank. On-board I2 serial presence-detect (SPD) EEPROM. Temperature sensor with integrated SPD. 16 internal banks; 4 groups of 4 banks each. Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS). Selectable BC4 or BL8 on-the-fly (OTF). Fly-by topology. Terminated control command and address bus. PCB: Height 1.23” (31.25mm). RoHS Compliant and Halogen-Free. Kingston's KSM32ED8/16HE is a 2G x 72-bit (16GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.. Features. JEDEC standard. Yes. SPD profile. Yes. Programming power voltage (VPP). 2.5 V. Row active time. 32 ns. Row cycle time. 45.75 ns. Module configuration. 2048M x 72. Memory voltage. 1.2 V. Memory ranking. 2. Memory channels. Dual-channel. Memory data transfer rate. 3200 MT/s. CAS latency. 22. ECC. Yes. Memory form factor. 288-pin DIMM. Component for. Server. Internal memory type. DDR4. Memory layout (modules x size). 2 x 8 GB. Internal memory. 16 GB. Buffered memory type. Unregistered (unbuffered). Operational conditions. Storage temperature (T-T). -55 - 100 °C. Operating temperature (T-T). 0 - 85 °C. Technical details. Compliance certificates. RoHS. Weight & dimensions. Height. 31.2 mm. Width. 133.3 mm. leaflet
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