HPE Xeon Intel -Platinum 8360HL 3.0GHz 24-core 225W Processor Kit for Superdome Flex 280

Intel® Xeon® Platinum 8360HL 3 GHz. 33 MB L3 LGA 4189. Processor cores: 24 14 nm 64-bit 225 W. Maximum internal memory supported by processor: 4.61 TB DDR4-SDRAM. Tray. Processor. Processor ARK ID. 205688. Processor codename. Cooper Lake. Thermal Design Power (TDP). 225 W. Processor cache type. L3. Processor cache. 33 MB. Processor boost frequency. 4.2 GHz. Processor operating modes. 64-bit. Processor threads. 48. Component for. Server/workstation. Cooler included. No. Processor lithography. 14 nm. Processor socket. LGA 4189. Processor cores. 24. Processor base frequency. 3 GHz. Processor model. 8360HL. Processor generation. 3rd Generation Intel® Xeon® Scalable. Processor family. Intel® Xeon® Platinum. Processor manufacturer. Intel. Memory. ECC. Yes. Memory channels. Hexa-channel. Memory clock speeds supported by processor. 3200 MHz. Memory types supported by processor. DDR4-SDRAM. Maximum internal memory supported by processor. 4.61 TB. Graphics. Discrete graphics card model. Not available. On-board graphics card model. Not available. On-board graphics card. No. Discrete graphics card. No. Features. Commodity Classification Automated Tracking System (CCATS). G077159. Export Control Classification Number (ECCN). 5A992C. Scalability. S8S. Embedded options available. No. Supported instruction sets. SSE4.2, AVX, AVX 2.0, AVX-512. PCI Express slots version. 3.0. Maximum number of PCI Express lanes. 48. Market segment. Server. Execute Disable Bit. Yes. Processor special features. Intel VT-x with Extended Page Tables (EPT). Yes. Intel 64. Yes. Intel Virtualization Technology (VT-x). Yes. Intel Virtualization Technology for Directed I/O (VT-d). Yes. AVX-512 Fused Multiply-Add (FMA) units. 2. Intel® Deep Learning Boost (Intel® DL Boost) on CPU. Yes. Intel® Resource Director Technology (Intel® RDT). Yes. Intel® Volume Management Device (VMD). Yes. Mode-based Execute Control (MBE). Yes. Intel® Optane™ DC Persistent Memory Supported. Yes. Intel® Run Sure Technology. Yes. Intel® Optane™ Memory Ready. Yes. Intel® Transactional Synchronization Extensions. Yes. Intel® Hyper Threading Technology (Intel® HT Technology). Yes. Intel® AES New Instructions (Intel® AES-NI). Yes. Intel® Speed Shift Technology. Yes. Enhanced Intel SpeedStep Technology. Yes. General. Product family. Xeon. Packaging data. Package type. Tray. Logistics data. Harmonized System (HS) code. 85423119. Technical details. Launch date. Q3'20. Status. Launched. Memory speed (max). 3200 MHz. Number of UPI links. 6. Target market. Cloud Computing. Supported memory types. DDR4-SDRAM. Weight & dimensions. Processor package size. 77.5 x 56.5 mm. Height. 114.3 mm. Depth. 285.7 mm. Width. 190.5 mm. Other features. Maximum internal memory. 4.5 TB