Toshiba KBG30ZMS512G internal solid state drive 512 GB M.2 PCI Express 3.1 NVMe TLC
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Toshiba 64-Layer BiCS FLASH™. PCIe® Gen3 2L NVMe™. Capacities up to 512GB. M.2 1620 single package and M.2 2230 single-sided form factor. TCG OPAL 2.01 Optional for SED. The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.. BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.. The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.. Features. Write speed. 1000 MB/s. Read speed. 1500 MB/s. Hardware encryption. No. Component for. Laptop. Memory type. TLC. NVMe. Yes. Interface. PCI Express 3.1. SSD form factor. M.2. SSD capacity. 512 GB. Power. Power consumption (write). 3.3 W. Power consumption (read). 3.3 W. Operating voltage. 3.3 V. Weight & dimensions. Weight. 2.42 g. Height. 2.38 mm. Depth. 30 mm. Width. 22 mm. Operational conditions. Non-operating shock. 1.5 G. Operating shock. 14.7 G. Non-operating vibration. 20 G. Operating vibration. 196 G. Storage temperature (T-T). -40 - 85 °C. Operating temperature (T-T). 0 - 80 °C. Logistics data. Harmonized System (HS) code. 84717070. manual pdfSingle Package NVMe™ SSD BG3 Series
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